发明专利
JP2003017454A Tool for cleaning substrate, and apparatus and method for treating the substrate
有权
基本信息:
- 专利标题： Tool for cleaning substrate, and apparatus and method for treating the substrate
- 专利标题（中）：用于清洁基板的工具，以及用于处理基板的装置和方法
- 申请号：JP2001199874 申请日：2001-06-29
- 公开(公告)号：JP2003017454A 公开(公告)日：2003-01-17
- 发明人： KUROSAWA MASAHIKO , HIRAKAWA TADAO
- 申请人： Shibaura Mechatronics Corp , Toshiba Corp , 株式会社東芝 , 芝浦メカトロニクス株式会社
- 专利权人： Shibaura Mechatronics Corp,Toshiba Corp,株式会社東芝,芝浦メカトロニクス株式会社
- 当前专利权人： Shibaura Mechatronics Corp,Toshiba Corp,株式会社東芝,芝浦メカトロニクス株式会社
- 优先权： JP2001199874 2001-06-29
- 主分类号： H01L21/304
- IPC分类号： H01L21/304
摘要：
PROBLEM TO BE SOLVED: To provide a tool for cleaning a substrate which maintains cleaning effects by preventing particles released, by cleaning from accumulating between cleaning brushes 31, 32 and a semiconductor wafer W, and which prevents a readhesion of the particles to a surface of the substrate.
SOLUTION: The tool 76 for cleaning the substrate cleans the substrate W, while making the substrate W rotate in the circumferential direction. The tool 76 comprises the cleaning brushes having large-diameter parts 31a, 32a at one ends to clean the surface of the substrate W, a brush holder 70 for holding the brushes incapable of dropping if and rotatably driving the brushes, and an opening 73 provided at a sidewall of the holder to discharge a treatment liquid which is to be supplied to the substrate W.
COPYRIGHT: (C)2003,JPO
摘要（中）：
SOLUTION: The tool 76 for cleaning the substrate cleans the substrate W, while making the substrate W rotate in the circumferential direction. The tool 76 comprises the cleaning brushes having large-diameter parts 31a, 32a at one ends to clean the surface of the substrate W, a brush holder 70 for holding the brushes incapable of dropping if and rotatably driving the brushes, and an opening 73 provided at a sidewall of the holder to discharge a treatment liquid which is to be supplied to the substrate W.
COPYRIGHT: (C)2003,JPO
要解决的问题：提供一种清洁基板的工具，其通过防止颗粒释放的清洁效果，通过清洁从清洁刷31,32和半导体晶片W之间的积聚而防止颗粒再次粘附到 底物。 解决方案：用于清洁基板的工具76在使基板W沿圆周方向旋转的同时清洁基板W。 工具76包括一端的具有大直径部分31a，32a的清洁刷，以清洁基板W的表面;刷子保持器70，用于保持刷子不能下落并且可旋转地驱动刷子;以及提供的开口73 在保持器的侧壁处排出要供应到基板W的处理液体。
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料 |
| --------------H01L21/26 | ....用波或粒子辐射轰击的 |
| ----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割 |
| ------------------H01L21/304 | ......机械处理，例如研磨、抛光、切割 |