发明公开
EP4421130A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING AND METHOD FOR IMPROVING TRANSMITTANCE OF THERMOPLASTIC RESIN COMPOSITION
审中-实审
基本信息:
- 专利标题： THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING AND METHOD FOR IMPROVING TRANSMITTANCE OF THERMOPLASTIC RESIN COMPOSITION
- 申请号：EP22883594.8 申请日：2022-10-19
- 公开(公告)号：EP4421130A1 公开(公告)日：2024-08-28
- 发明人： KATO Noriyuki , NISHIMORI Katsushi , IKEDA Shinya , MOTEGI Atsushi , MURATA SUZUKI Shoko , OCHI Noriaki , KANDA Masahiro , NAGAI Masayuki , MORISHITA Takami , IKEDA Shinichi , OMURA Kazufumi
- 申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 申请人地址： JP Chiyoda-ku Tokyo 100-8324 5-2, Marunouchi 2-chome
- 专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址： JP Chiyoda-ku Tokyo 100-8324 5-2, Marunouchi 2-chome
- 代理机构： Hoffmann Eitle
- 优先权： JP 21173347 2021.10.22
- 国际申请： JP2022038889 2022.10.19
- 国际公布： WO2023068290 2023.04.27
- 主分类号： C08L101/00
- IPC分类号： C08L101/00 ; C08K5/00 ; C08K5/13 ; C08K5/1535 ; C08K5/51 ; C08L33/06 ; C08L45/00 ; C08L67/00 ; C08L69/00
摘要：
Provided are a thermoplastic resin composition and the like that enable suppression of a change in transmittance such as when an additive is added, in particular, a change in transmittance in the short wavelength range. This thermoplastic resin composition contains a compound agent represented by general formula (1). (In general formula (1), R1-R5 each independently represent a hydrogen atom, an alkyl group or an alkoxy group having a total of 1-20 carbon atoms and optionally having a substituent group, or a structural formula of general formula (1-1). However, at least one of R1-R5 represents the structural formula of general formula (1-1), R6-R9 each independently represent a hydrogen atom, or an alkyl group or an alkoxy group having a total of 1-20 carbon atoms and optionally having a substituent group, and R10 represents a hydrogen atom or an alkyl group having a total of 1-5 carbon atoms.) (In general formula (1-1), Rn-Ris, R20, L, *, and ** are each described in the description of the present application.)
IPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |
| ------C08L101/00 | 未指明的高分子化合物的组合物 |