基本信息:
- 专利标题： DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
- 申请号：EP23195062.7 申请日：2023-09-04
- 公开(公告)号：EP4394865A1 公开(公告)日：2024-07-03
- 发明人： Shan, Bohan , Chen, Haobo , Nie, Bai , Pietambaram, Srinivas , Duan, Gang , Arrington, Kyle , Lin, Ziyin , Feng, Hongxia , Bai, Yiqun , Guo, Xiaoying , Xu, Dingying , Darmawikarta, Kristof
- 申请人： Intel Corporation
- 申请人地址： US Santa Clara, CA 95054 2200 Mission College Boulevard
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US Santa Clara, CA 95054 2200 Mission College Boulevard
- 代理机构： Goddar, Heinz J.
- 优先权： US 2218090707 2022.12.29
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/538 ; H01L25/065
摘要：
An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, a layer of organic dielectric material over the plurality of interconnect layers, copper pads within the layer of organic dielectric material, a first integrated circuit device copper-to-copper bonded with the copper pads, inorganic dielectric material over the layer of organic dielectric material, the inorganic dielectric material embedding the first integrated circuit device, and the inorganic dielectric material extending across a width of the substrate, and a second integrated circuit device coupled with a substrate surface above the inorganic dielectric material. Other embodiments are also disclosed and claimed.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
| ------------H01L23/498 | ...引线位于绝缘衬底上的 |