基本信息:
- 专利标题： MULTILAYER ELECTRONIC COMPONENT
- 申请号：EP23209572.9 申请日：2023-11-14
- 公开(公告)号：EP4390994A2 公开(公告)日：2024-06-26
- 发明人： Kang, Sung Yong
- 申请人： Samsung Electro-Mechanics Co., Ltd.
- 申请人地址： KR Suwon-si, Gyeonggi-do Maeyoung-ro 150 (Maetan-dong), Youngtong-gu
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do Maeyoung-ro 150 (Maetan-dong), Youngtong-gu
- 代理机构： Grünecker Patent- und Rechtsanwälte PartG mbB
- 优先权： KR 220180177 2022.12.21
- 主分类号： H01G4/30
- IPC分类号： H01G4/30 ; H01G4/12 ; H01G4/224 ; H01G4/232 ; H01G4/012
摘要：
A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.
公开/授权文献:
- EP4390994A3 MULTILAYER ELECTRONIC COMPONENT 公开/授权日：2024-07-10
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01G | 电容器；电解型的电容器、整流器、检波器、开关器件、光敏器件或热敏器件 |
| ------H01G4/00 | 固定电容器；及其制造方法 |
| --------H01G4/30 | .叠层电容器 |