A semiconductor package structure (500, 700b) is provided. The semiconductor package structure (500, 700b) includes a substrate, a first semiconductor die (115a), and a second semiconductor die (115b). The substrate includes a first substrate partition (502a) and a second substrate partition (502b). The first substrate partition (502a) has a first wiring structure. The second substrate partition (502b) is adjacent to the first substrate partition (502a) and has a second wiring structure. The first substrate partition (502a) and the second substrate partition (502b) are surrounded by a first molding material (504). The first semiconductor die (115a) is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die (115b) is disposed over the substrate and electrically coupled to the second wiring structure. The semiconductor package structure (500b) further comprises a frame (113) surrounding the first substrate (502a) and the second substrate (502b), wherein the frame (113) is surrounded by the first molding material (504).