发明公开
EP4300153A1 HYBRID BONDING WITH PHOTONIC INTEGRATED CIRCUITS FOR HIGH BANDWIDTH RETICLE STITCHING OF RETICLE SIZED INTEGRATED CIRCUIT DIES
审中-实审
基本信息:
- 专利标题： HYBRID BONDING WITH PHOTONIC INTEGRATED CIRCUITS FOR HIGH BANDWIDTH RETICLE STITCHING OF RETICLE SIZED INTEGRATED CIRCUIT DIES
- 申请号：EP23175293.2 申请日：2023-05-25
- 公开(公告)号：EP4300153A1 公开(公告)日：2024-01-03
- 发明人： SUTHRAM, Sagar , MALLIK, Debendra , HECK, John , RANADE, Pushkar Sharad , MAHAJAN, Ravindranath Vithal , LILJEBERG, Thomas , GOMES, Wilfred , SHARMA, Abhishek A. , GHANI, Tahir
- 申请人： INTEL Corporation
- 申请人地址： US Santa Clara, CA 95054 2200 Mission College Blvd.
- 代理机构： 2SPL Patentanwälte PartG mbB
- 优先权： US202217853732 20220629
- 主分类号： G02B6/43
- IPC分类号： G02B6/43 ; G02B6/12
摘要：
Embodiments of a microelectronic assembly comprise: a plurality of microelectronic sub-assemblies arranged in an array; and a plurality of photonic integrated circuit (PIC) dies, each PIC die having waveguides. Adjacent microelectronic sub-assemblies are coupled to one of the PIC dies by interconnects such that any one PIC die is coupled to more than two adjacent microelectronic sub-assemblies, and the microelectronic sub-assemblies coupled to each PIC die in the plurality of PIC dies are communicatively coupled by the waveguides in the PIC die. Each microelectronic subassembly comprises: an interposer integrated circuit (IC) die comprising one or more electrical controller circuit proximate to at least one edge of the interposer IC die; a first plurality of IC dies coupled to a first surface of the interposer IC die; and a second plurality of IC dies coupled to an opposing second surface of the interposer IC die.
IPC结构图谱:
| G | 物理 |
| --G02 | 光学 |
| ----G02B | 光学元件、系统或仪器 |
| ------G02B6/00 | 光导；包含光导和其他光学元件（如耦合器）的装置的结构零部件 |
| --------G02B6/02 | .带有包层的光导纤维 |
| ----------G02B6/26 | ..光耦合装置 |
| ------------G02B6/43 | ...包含有多个光电元件和相应的光学互连器的装置 |