发明公开
EP4258352A2 METHOD OF JOINING MICROELECTRONIC ELEMENTS OF A MICROELECTRONIC ASSEMBLY USING NANOSCALE CONDUCTORS FABRICATED IN AN INSULATING NANOSCALE MATRIX OBTAINED FROM A DIBLOCK COPOLYMER
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基本信息:
- 专利标题： METHOD OF JOINING MICROELECTRONIC ELEMENTS OF A MICROELECTRONIC ASSEMBLY USING NANOSCALE CONDUCTORS FABRICATED IN AN INSULATING NANOSCALE MATRIX OBTAINED FROM A DIBLOCK COPOLYMER
- 申请号：EP23192531.4 申请日：2017-04-27
- 公开(公告)号：EP4258352A2 公开(公告)日：2023-10-11
- 发明人： WANG, Liang , LEE, Bongsub , HABA, Belgacem , LEE, Sangil
- 申请人： Invensas Corporation
- 申请人地址： US San Jose, CA 95134 3025 Orchard Parkway
- 当前专利权人： ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- 当前专利权人地址： ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- 代理机构： Haley Guiliano International LLP
- 优先权： US201615147807 20160505
- 主分类号： H01L25/065
- IPC分类号： H01L25/065
摘要：
A microelectronic assembly including an insulating layer having a plurality of nanoscale conductors disposed in a nanoscale pitch array therein and a pair of microelectronic elements is provided. The nanoscale conductors can form electrical interconnections between contacts of the microelectronic elements while the insulating layer can mechanically couple the microelectronic elements together.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/065 | ...包含在H01L27/00组类型的器件 |