发明公开
EP4245517A1 MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
审中-实审
转让
基本信息:
- 专利标题： MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
- 申请号：EP21892025.4 申请日：2021-11-16
- 公开(公告)号：EP4245517A1 公开(公告)日：2023-09-20
- 发明人： HAYASHI, Chihiro , KAKITANI, Minoru , TANIGAWA, Takao , AKEBI, Ryuji , SATO, Naoyoshi , HORIE, Akira
- 申请人： Resonac Corporation
- 申请人地址： JP Tokyo 105-8518 13-9, Shiba Daimon 1-chome Minato-ku
- 当前专利权人： RESONAC CORPORATION
- 当前专利权人地址： RESONAC CORPORATION
- 代理机构： Hoffmann Eitle
- 优先权： JP2020190381 20201116
- 国际公布： WO2022102780 20220519
- 主分类号： B32B5/28
- IPC分类号： B32B5/28 ; B32B27/30 ; C08F290/12 ; C08L39/04 ; C08L51/04 ; C08L53/02 ; C08J5/24 ; B32B15/08 ; H05K1/03
摘要：
Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.
IPC结构图谱:
| B | 作业；运输 |
| --B32 | 层状产品 |
| ----B32B | 层状产品，即由扁平的或非扁平的薄层，例如泡沫状的、蜂窝状的薄层构成的产品 |
| ------B32B5/00 | 以非同质性或物理结构薄层为特征的层状产品 |
| --------B32B5/18 | .以含有泡沫材料或特殊多孔材料的薄层特性为特征的 |
| ----------B32B5/24 | ..一层是纤维或细丝薄层 |
| ------------B32B5/28 | ...用塑性物质浸渍的或埋置于塑性物质中的 |