基本信息:
- 专利标题： SEMICONDUCTOR PACKAGE WITH INTEGRATED ANTENNA AND SHIELDING PILLARS
- 申请号：EP22211882.0 申请日：2022-12-07
- 公开(公告)号：EP4210166A3 公开(公告)日：2023-09-06
- 发明人： LIN, Tzu-Hung , HUNG, Chih-Ming , CHIU, Shih-Chia
- 申请人： MediaTek Inc.
- 申请人地址： TW Hsin-Chu 300 No. 1, Dusing Rd. 1st Science-Based Industrial Park
- 代理机构： Hoefer & Partner Patentanwälte mbB
- 优先权： US202217987873 20221116
- 主分类号： H01Q1/22
- IPC分类号： H01Q1/22 ; H01L23/552 ; H01L23/66 ; H01L23/00 ; H01L23/538 ; H01L25/065 ; H01L23/498
摘要：
A semiconductor package (1) includes a base film (PA1), a semiconductor die (100) on the base film (PA1), metal studs (102) on the semiconductor die (100), shielding pillars (SP) on the base film (PA1) and around the semiconductor die (100), a first molding compound (MC1) encapsulating the semiconductor die (100), the metal studs (102), and the shielding pillars (SP), a first re-distribution structure (RDL) on the first molding compound (MC1), a second molding compound (MC2) on the first re-distribution structure (RDL), through-mold-vias (202) in the second molding compound (MC2), and a second re-distribution structure (RDT) on the second molding compound (MC2) and electrically connected to the through-mold-vias (202). The second re-distribution structure (RDT) comprises an antenna (AT).
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01Q | 天线 |
| ------H01Q1/00 | 天线零部件或与天线结合的装置 |
| --------H01Q1/08 | .折叠天线或其附件的装置 |
| ----------H01Q1/22 | ..结构上与其他设备或物体相结合的 |