基本信息:
- 专利标题： CAMERA MODULE, ELECTRONIC DEVICE AND VEHICLE INSTRUMENT
- 申请号：EP22176671.0 申请日：2022-06-01
- 公开(公告)号：EP4102570A2 公开(公告)日：2022-12-14
- 发明人： TSAI, Wen-Yu , CHANG, Chien-Pang , CHANG, Lin-An , CHOU, Ming-Ta , LIN, Cheng-Fen , CHU, Kuo-Chiang
- 申请人： Largan Precision Co. Ltd.
- 申请人地址： TW Taichung City 408 No. 11, Jingke Rd. Nantun District
- 当前专利权人： LARGAN PRECISION CO., LTD.
- 当前专利权人地址： LARGAN PRECISION CO., LTD.
- 代理机构： Jakelski & Althoff Patentanwälte PartG mbB
- 优先权： TW110137630 20211008
- 主分类号： H01L27/146
- IPC分类号： H01L27/146
摘要：
A camera module includes an imaging lens assembly module and an image sensor. The image sensor is disposed on an image surface of the imaging lens assembly module and includes a photoelectric converting layer, a micro lens arrays layer, a light filtering layer and an anti-reflecting layer. The photoelectric converting layer is for converting a light signal to an electric signal. The micro lens arrays layer is for converging an energy of the imaging light into the photoelectric converting layer. The light filtering layer is for absorbing a light at a certain wavelength region of the imaging light. The anti-reflecting layer is disposed on a surface of at least one of the light filtering layer and the micro lens arrays layer and includes an irregular nano-crystallite structure layer and an optical connecting layer. The optical connecting layer is connected to the irregular nano-crystallite structure layer.
公开/授权文献:
- EP4102570A3 CAMERA MODULE, ELECTRONIC DEVICE AND VEHICLE INSTRUMENT 公开/授权日：2023-01-04
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
| --------H01L27/02 | .包括有专门适用于整流、振荡、放大或切换的半导体组件并且至少有一个电位跃变势垒或者表面势垒的；包括至少有一个跃变势垒或者表面势垒的无源集成电路单元的 |
| ----------H01L27/144 | ..由辐射控制的器件 |
| ------------H01L27/146 | ...图像结构 |