基本信息:
- 专利标题： PALLADIUM PLATING SOLUTION AND PLATING METHOD
- 申请号：EP21166181.4 申请日：2021-03-31
- 公开(公告)号：EP3901327A1 公开(公告)日：2021-10-27
- 发明人： KANEKO, Yohei , OOGAMI, Yuhei , TANABE, Katsuhisa , MAEDA, Tsuyoshi
- 申请人： C. Uyemura & Co., Ltd.
- 申请人地址： JP Osaka-shi, Osaka 541-0045 2-6, Dosho-machi 3-chome Chuo-ku
- 代理机构： Müller Hoffmann & Partner
- 优先权： JP2020067193 20200403
- 主分类号： C23C18/42
- IPC分类号： C23C18/42 ; C23C18/44
摘要：
The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.