发明公开
EP3702391A1 COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
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基本信息:
- 专利标题: COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
- 申请号:EP18871718.5 申请日:2018-10-26
- 公开(公告)号:EP3702391A1 公开(公告)日:2020-09-02
- 发明人: NISHITANI Yoshinori , MINAMI Masaki , SATO Tatsuki
- 申请人: JXTG Nippon Oil & Energy Corporation
- 申请人地址: 1-2, Otemachi 1-chome Chiyoda-ku Tokyo 100-8162 JP
- 专利权人: JXTG Nippon Oil & Energy Corporation
- 当前专利权人: ENEOS MATERIALS CORPORATION
- 当前专利权人地址: ENEOS MATERIALS CORPORATION
- 代理机构: Müller-Boré & Partner Patentanwälte PartG mbB
- 优先权: JP2017208606 20171027
- 国际公布: WO2019083004 20190502
- 主分类号: C08G59/40
- IPC分类号: C08G59/40 ; H01L23/29 ; H01L23/31
摘要:
[Problem] To provide a curable resin composition for obtaining a cured product that is excellent in high heat resistance and high-temperature stability, a cured product thereof, and methods of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the cured product as a sealant.
[Solution] A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
[Solution] A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).