发明公开
EP3702390A1 COMPOSITION FOR CURED RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
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基本信息:
- 专利标题： COMPOSITION FOR CURED RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
- 申请号：EP18869515.9 申请日：2018-10-26
- 公开(公告)号：EP3702390A1 公开(公告)日：2020-09-02
- 发明人： NISHITANI, Yoshinori , MINAMI, Masaki , SATO, Tatsuki
- 申请人： JXTG Nippon Oil & Energy Corporation
- 申请人地址： 1-2, Otemachi 1-chome Chiyoda-ku Tokyo 100-8162 JP
- 专利权人： JXTG Nippon Oil & Energy Corporation
- 当前专利权人： ENEOS MATERIALS CORPORATION; JP
- 当前专利权人地址： ENEOS MATERIALS CORPORATION; JP
- 代理机构： Müller-Boré & Partner Patentanwälte PartG mbB
- 优先权： JP2017208602 20171027
- 国际公布： WO2019083003 20190502
- 主分类号： C08G59/40
- IPC分类号： C08G59/40 ; H01L23/29 ; H01L23/31
摘要：
[Problem] To provide a curable resin composition excellent in fast curability at low temperature for obtaining a cured product high in heat resistance, a cured product thereof, and methods of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the cured product as a sealant.
[Solution] A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
[Solution] A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).