基本信息:
- 专利标题： PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR ELECTRONIC BONDING APPLICATIONS
- 申请号：EP18155824.8 申请日：2018-02-08
- 公开(公告)号：EP3524654A1 公开(公告)日：2019-08-14
- 发明人： Bieber, Pierre Reinhard , McAllister, John W. , Bending, Benjamin , Chen, Zhong , Sahni, Vasav
- 申请人： 3M Innovative Properties Company
- 申请人地址： 3M Center Saint Paul, MN 55133-3427 US
- 专利权人： 3M Innovative Properties Company
- 当前专利权人： 3M Innovative Properties Company
- 当前专利权人地址： 3M Center Saint Paul, MN 55133-3427 US
- 代理机构： Gabriel, Kiroubagaranne
- 主分类号： C09J123/22
- IPC分类号： C09J123/22
摘要：
The present disclosure relates to a curable pressure sensitive adhesive composition comprising:
a) a butyl rubber component in an amount greater than 40 wt%;
b) a tackifier in an amount greater than 1 wt%;
c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and
d) optionally, a hydrocarbon plasticizer;
wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition.
In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above.
According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.
a) a butyl rubber component in an amount greater than 40 wt%;
b) a tackifier in an amount greater than 1 wt%;
c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and
d) optionally, a hydrocarbon plasticizer;
wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition.
In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above.
According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.
公开/授权文献:
IPC结构图谱:
| C | 化学；冶金 |
| --C09 | 染料；涂料；抛光剂；天然树脂；黏合剂；其他类目不包含的组合物；其他类目不包含的材料的应用 |
| ----C09J | 黏合剂；一般黏合方法（非机械部分）；其他类目不包括的黏合方法；黏合剂材料的应用 |
| ------C09J123/00 | 基于只有1个碳—碳双键的不饱和脂族烃的均聚物或共聚物的黏合剂；基于此种聚合物的衍生物的黏合剂 |
| --------C09J123/02 | .未经化学后处理改性的 |
| ----------C09J123/18 | ..有4个或更多个碳原子的烃的均聚物或共聚物 |
| ------------C09J123/20 | ...有4～9个碳原子的 |
| --------------C09J123/22 | ....异丁烯的共聚物；丁基橡胶 |