基本信息:
- 专利标题： SEMICONDUCTOR PACKAGE WITH AIR CAVITY
- 申请号：EP18210961.1 申请日：2018-12-07
- 公开(公告)号：EP3495318A2 公开(公告)日：2019-06-12
- 发明人： CHIANG, Chau Fatt , CHUA, Kok Yau , KUEK, Hsieh Ting , BAKAR, Roslie Saini bin , ABDUL WAHID, Junny , CHONG, Hock Heng , POK, Pei Luan , LEE, Chee Hong , SCHMALZL, Stefan , REISS, Werner , CHIN, Kon Hoe , LIEW, Soon Lee , OTHMAN, Nurfarena , TUAZON BERNARDEZ, April Coleen
- 申请人： Infineon Technologies AG
- 申请人地址： Am Campeon 1-15 85579 Neubiberg DE
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： Am Campeon 1-15 85579 Neubiberg DE
- 代理机构： Lambsdorff & Lange Patentanwälte Partnerschaft mbB
- 优先权： US201762596177P 20171208
- 主分类号： B81B7/00
- IPC分类号： B81B7/00 ; B81C1/00
摘要：
Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.
公开/授权文献:
- EP3495318A3 SEMICONDUCTOR PACKAGE WITH AIR CAVITY 公开/授权日：2019-08-21