基本信息:
- 专利标题： SEMICONDUCTOR PACKAGE WITH INTEGRATED HARMONIC FILTERING FEATURE
- 申请号：EP18171452.8 申请日：2018-05-09
- 公开(公告)号：EP3410475A1 公开(公告)日：2018-12-05
- 发明人： AGAR, Bill , LIU, Yang , ZHANG, XiKun
- 申请人： Infineon Technologies AG
- 申请人地址： Am Campeon 1-15 85579 Neubiberg DE
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： Am Campeon 1-15 85579 Neubiberg DE
- 代理机构： Moore, Derek
- 优先权： US201715610805 20170601
- 主分类号： H01L23/66
- IPC分类号： H01L23/66 ; H01L23/047 ; H01P3/08 ; H03F3/193
摘要：
In an embodiment, a semiconductor package includes a metal flange having a lower surface and an upper surface opposite the lower surface. An electrically insulating window frame is disposed on the upper surface of the flange. The electrically insulating window frame forms a ring around a periphery of the metal flange so as to expose the upper surface of the metal flange in a central die attach region. A first electrically conductive lead is disposed on the electrically insulating window frame and extends away from a first side of the metal flange. A second electrically conductive lead is disposed on the electrically insulating window frame and extends away from a second side of the metal flange, the second side being opposite the first side. A first harmonic filtering feature is formed on a portion of the electrically insulating window frame and is electrically connected to the first electrically conductive lead.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/64 | ..阻抗装置 |
| ------------H01L23/66 | ...高频匹配器 |