基本信息:
- 专利标题： STACKED FILTERS
- 申请号：EP16810122.8 申请日：2016-11-04
- 公开(公告)号：EP3400626A1 公开(公告)日：2018-11-14
- 发明人： HANSEN, Bradley, O. , BEYLOR, Michael, R. , PATRICK, Kevin, W. , BALDWIN, Jeremy, Bart , GORDON, Michael, D.
- 申请人： Raytheon Company
- 申请人地址： 870 Winter Street Waltham, MA 02451-1449 US
- 专利权人： Raytheon Company
- 当前专利权人： Raytheon Company
- 当前专利权人地址： 870 Winter Street Waltham, MA 02451-1449 US
- 代理机构： Jackson, Richard Eric
- 优先权： US201614990428 20160107
- 国际公布： WO2017119945 20170713
- 主分类号： H01P1/203
- IPC分类号： H01P1/203
摘要：
A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.
公开/授权文献:
- EP3400626B1 STACKED FILTERS 公开/授权日：2021-03-17