基本信息:
- 专利标题： SUPERCONDUCTING BUMP BONDS
- 申请号：EP15828622.9 申请日：2015-12-30
- 公开(公告)号：EP3391415A1 公开(公告)日：2018-10-24
- 发明人： MUTUS, Joshua Yousouf , LUCERO, Erik Anthony
- 申请人： Google LLC , Mutus, Joshua Yousouf , Lucero, Erik Anthony
- 申请人地址： 1600 Amphitheatre Parkway Mountain View, CA 94043 US
- 专利权人： Google LLC,Mutus, Joshua Yousouf,Lucero, Erik Anthony
- 当前专利权人： GOOGLE LLC
- 当前专利权人地址： GOOGLE LLC
- 代理机构： Watkin, Timothy Lawrence Harvey
- 优先权： US201562267824P 20151215
- 国际公布： WO2017105524 20170622
- 主分类号： H01L27/18
- IPC分类号： H01L27/18 ; H01L23/498
摘要：
A device (100) includes a first chip (104) having a first circuit element (112), a first interconnect pad (116) in electrical contact (118) with the first circuit element, and a barrier layer (120) on the first interconnect pad, a superconducting bump bond (106) on the barrier layer, and a second chip (102) joined to the first chip by the superconducting bump bond, the second chip having a quantum circuit element (108), in which the superconducting bump bond provides an electrical connection between the first circuit element and the quantum circuit element.
公开/授权文献:
- EP3391415B1 SUPERCONDUCTING BUMP BONDS 公开/授权日：2019-08-21
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
| --------H01L27/18 | .包括有呈现超导电性的组件的 |