发明公开
EP3359709A1 COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND POLYACRYLAMIDES
有权
基本信息:
- 专利标题： COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUCTS OF AMINES AND POLYACRYLAMIDES
- 申请号：EP15905660.5 申请日：2015-10-08
- 公开(公告)号：EP3359709A1 公开(公告)日：2018-08-15
- 发明人： LU, Weijing , DUAN, Lingli , NIAZIMBETOVA, Zukhra , CHEN, Chen , RZEZNIK, Maria
- 申请人： Rohm and Haas Electronic Materials LLC , Dow Global Technologies, LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Rohm and Haas Electronic Materials LLC,Dow Global Technologies, LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC,Dow Global Technologies, LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Houghton, Mark Phillip
- 国际公布： WO2017059562 20170413
- 主分类号： C25D3/38
- IPC分类号： C25D3/38
摘要：
Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.