基本信息:
- 专利标题： ELECTRICAL CONTACT AND SOCKET FOR ELECTRICAL COMPONENT
- 申请号：EP16839142.3 申请日：2016-08-16
- 公开(公告)号：EP3343704A1 公开(公告)日：2018-07-04
- 发明人： ODA, Takahiro
- 申请人： Enplas Corporation
- 申请人地址： 30-1, Namiki 2-chome Kawaguchi-shi Saitama 332-0034 JP
- 专利权人： Enplas Corporation
- 当前专利权人： Enplas Corporation
- 当前专利权人地址： 30-1, Namiki 2-chome Kawaguchi-shi Saitama 332-0034 JP
- 代理机构： Grünecker Patent- und Rechtsanwälte PartG mbB
- 优先权： JP2015166276 20150825
- 国际公布： WO2017033795 20170302
- 主分类号： H01R13/03
- IPC分类号： H01R13/03 ; G01R1/073 ; G01R31/26
摘要：
Contact pins are provided to a socket main body for accommodating an IC package so as to be in contact with connection terminals of the IC package accommodated in the socket main body. Each contact pin includes a conductive substrate and multiple layers laminated on the surface of the substrate, including: an underlying layer formed on the substrate by Ni plating; a first surface layer formed on the underlying layer by Pd-Ni alloy plating; a second surface layer formed on the first surface layer by Ni plating, thus allowing Sn from the corresponding connection terminal to diffuse into the second surface layer at a rate lower than into a conventional plated Ag layer; and an outermost surface layer formed on the second surface layer by Au plating to serve as an electrical contact layer.