基本信息:
- 专利标题： CHIPANORDNUNG UND VERFAHREN ZUR AUSBILDUNG EINER KONTAKTVERBINDUNG
- 专利标题（英）：EP3271938A2 - Chip assembly and method for forming a contact connection
- 专利标题（中）：芯片布置和形成接触连接的方法
- 申请号：EP16706510.1 申请日：2016-02-15
- 公开(公告)号：EP3271938A2 公开(公告)日：2018-01-24
- 发明人： LÜDEKE, Heinrich , GEELHAAR, Ricardo
- 申请人： Pac Tech - Packaging Technologies GmbH
- 申请人地址： Am Schlangenhorst 15-17 14641 Nauen DE
- 专利权人： Pac Tech - Packaging Technologies GmbH
- 当前专利权人： PAC TECH - PACKAGING TECHNOLOGIES GMBH
- 当前专利权人地址： PAC TECH - PACKAGING TECHNOLOGIES GMBH
- 代理机构： advotec.
- 优先权： DE102015103779 20150316
- 国际公布： WO2016146323 20160922
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/488 ; B23K26/20
摘要：
The invention relates to a chip arrangement (10) and a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material strip (14), said conductor material strip being formed on a non-conductive substrate (12) and the chip being arranged on the substrate or on a conductor material strip (15). A silver paste (29) or copper paste is applied to a chip contact surface (25) of the chip and of the conductor material strip (28), a contact conductor (30) is dipped into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material strip, and a solvent contained in the silver paste or the copper paste is at least partially evaporated by heating. The silver paste or the copper paste is then sintered by means of laser energy, thereby forming the contact connection.
公开/授权文献:
- EP3271938B1 VERFAHREN ZUR AUSBILDUNG EINER KONTAKTVERBINDUNG 公开/授权日：2024-07-10
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |