发明公开
EP3215470A1 MECHANICALLY FORMING CRACK INITIATION DEFECTS IN THIN GLASS SUBSTRATES USING AN ABRASIVE SURFACE
审中-公开
基本信息:
- 专利标题： MECHANICALLY FORMING CRACK INITIATION DEFECTS IN THIN GLASS SUBSTRATES USING AN ABRASIVE SURFACE
- 专利标题（中）：利用磨料表面机械地形成薄玻璃衬底中的裂纹引发缺陷
- 申请号：EP15805000.5 申请日：2015-11-05
- 公开(公告)号：EP3215470A1 公开(公告)日：2017-09-13
- 发明人： BIGELOW, Donald Orrin , BOOTH, Robertson Dewhurst , WATKINS, James Joseph
- 申请人： Corning Incorporated
- 申请人地址： 1 Riverfront Plaza Corning, New York 14831 US
- 专利权人： Corning Incorporated
- 当前专利权人： Corning Incorporated
- 当前专利权人地址： 1 Riverfront Plaza Corning, New York 14831 US
- 代理机构： Scheuermann, Erik
- 优先权： US201462076539P 20141107
- 国际公布： WO2016073680 20160512
- 主分类号： C03B33/09
- IPC分类号： C03B33/09 ; C03B33/10 ; C03B33/023 ; C03B33/03
摘要：
A method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates is provided. The method includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate. The field of initiation defects has a width of at least about three millimetres between outermost initiation defects. At least one initiation defect is heated with a laser source. The at least one initiation defect is cooled with a cooling fluid such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating across the glass substrate to separate the glass substrate into the plurality of substrates.
摘要（中）：
提供了一种用于在玻璃基板中形成起始缺陷以便于将玻璃基板分离成多个基板的方法。 该方法包括提供玻璃基板并使玻璃基板的宽表面与研磨表面接触，从而在玻璃基板的宽表面中形成起始缺陷区。 起始缺陷的领域在最外面的起始缺陷之间具有至少约三毫米的宽度。 用激光源加热至少一个初始缺陷。 所述至少一个初始缺陷用冷却流体冷却，使得裂缝从所述至少一个初始缺陷开始，所述裂缝延伸穿过玻璃基板的厚度并且穿过玻璃基板传播以将玻璃基板分离成多个 基板。