发明公开
EP3165321A1 METHOD FOR BONDING COMPOSITE MATERIALS AND DEVICE FOR BONDING COMPOSITE MATERIALS
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基本信息:
- 专利标题: METHOD FOR BONDING COMPOSITE MATERIALS AND DEVICE FOR BONDING COMPOSITE MATERIALS
- 专利标题(中):方法连接复合材料和器件于连接复合材料
- 申请号:EP14896478.6 申请日:2014-07-03
- 公开(公告)号:EP3165321A1 公开(公告)日:2017-05-10
- 发明人: NAKANO, Takahiro , OORUI, Toshiaki , FUJISAWA, Shinji
- 申请人: NISSAN MOTOR CO., LTD.
- 申请人地址: 2 Takara-cho Kanagawa-ku Yokohama-shi, Kanagawa 220-8623 JP
- 专利权人: NISSAN MOTOR CO., LTD.
- 当前专利权人: ENVISION AESC JAPAN LTD.
- 当前专利权人地址: ENVISION AESC JAPAN LTD.
- 代理机构: Global IP Europe Patentanwaltskanzlei
- 国际公布: WO2016002059 20160107
- 主分类号: B23K20/10
- IPC分类号: B23K20/10
摘要:
[Object] To provide a method for bonding composite materials with which it is possible to bond composite materials, each comprising a melting material and a heat-resistant material that greatly differ in melting point to each other, with the heat-resistant materials facing each other
[Solution] A method is used for bonding composite materials (ceramic separators 40) that are each provided with a melting material (polypropylene layer 41) and a heat-resistant material (ceramic layer 42) comprising a heat-resistant member (ceramic particles 42M) and a binder member (binder 42N). A pair of ceramic separators with the ceramic layers facing each other are bonded. An ultrasonic wave is applied to the ceramic separators while applying a pressure thereto by the processing member (ultrasonic horn 141), and heat T is applied to the binder with a heating member (heater 147). Here, the heater 147 heats the binder to a temperature that is greater than or equal to the glass transition temperature of the binder and less than the melting point of the polypropylene layer.
摘要(中):
[Solution] A method is used for bonding composite materials (ceramic separators 40) that are each provided with a melting material (polypropylene layer 41) and a heat-resistant material (ceramic layer 42) comprising a heat-resistant member (ceramic particles 42M) and a binder member (binder 42N). A pair of ceramic separators with the ceramic layers facing each other are bonded. An ultrasonic wave is applied to the ceramic separators while applying a pressure thereto by the processing member (ultrasonic horn 141), and heat T is applied to the binder with a heating member (heater 147). Here, the heater 147 heats the binder to a temperature that is greater than or equal to the glass transition temperature of the binder and less than the melting point of the polypropylene layer.
本发明的课题是提供一种用于粘合复合材料与它能够接合的复合材料的方法,每一个都包括一个熔化材料和耐热材料在熔点没有很大区别海誓山盟,与耐热材料彼此面对 其他[解决方法]使用了一种方法用于粘合复合材料(陶瓷隔板40)那样分别设置有一个熔化材料(聚丙烯层41)和包含耐热构件的耐热材料(陶瓷层42)(陶瓷粒子 42M)和粘合剂部件(粘合剂42N)。 一对陶瓷隔板海誓山盟面向陶瓷层接合。 超声波被施加到陶瓷隔板而由处理构件(超声波喇叭141)施加压力于此,并且热T被应用于具有加热部件(加热器147)的粘合剂。 在此,加热器147加热粘合剂大于或等于一个温度做是将粘合剂和小于所述聚丙烯层的熔点的玻璃化转变温度。
公开/授权文献:
- EP3165321B1 METHOD FOR BONDING COMPOSITE MATERIALS 公开/授权日:2021-02-24
IPC结构图谱:
B | 作业;运输 |
--B23 | 机床;不包含在其他类目中的金属加工 |
----B23K | 钎焊或脱焊;焊接;用钎焊或焊接方法包覆或镀敷;局部加热切割,如火焰切割;用激光束加工 |
------B23K20/00 | 利用冲击或其他压力的非电焊接,用或不用加热,例如包覆或镀敷 |
--------B23K20/10 | .利用振动,例如超声波焊接 |