发明公开
EP3115938A1 A MULTILAYER PACKAGE COMPRISING A RADIOFREQUENCY TAG AND A METHOD FOR MAKING THE SAME
审中-公开
基本信息:
- 专利标题： A MULTILAYER PACKAGE COMPRISING A RADIOFREQUENCY TAG AND A METHOD FOR MAKING THE SAME
- 专利标题（中）：连同其产生射频标签和方法分层包装
- 申请号：EP15306120.5 申请日：2015-07-08
- 公开(公告)号：EP3115938A1 公开(公告)日：2017-01-11
- 发明人： Lognon, Laurent
- 申请人： HMY Group
- 申请人地址： 50 route d'Auxerre 89470 Moneteau FR
- 专利权人： HMY Group
- 当前专利权人： HMY Group
- 当前专利权人地址： 50 route d'Auxerre 89470 Moneteau FR
- 代理机构： Santarelli
- 主分类号： G06K19/077
- IPC分类号： G06K19/077
摘要：
There is provided a multilayer package having at least one conductive layer, comprising a radiofrequency tag (20), the radiofrequency tag comprising a radiofrequency identification circuit (22) and a slot antenna (24a), the radiofrequency identification circuit being linked to the slot antenna that is formed in the at least one conductive layer of the multilayer package.
There is also provided a method for making a multilayer package comprising a radiofrequency tag, comprising the following steps:
- obtaining a multilayer package having at least one conductive layer, a slot antenna being formed in the at least one conductive layer of the multilayer package; and
- installing a radiofrequency identification circuit on the multilayer package, so as to link the radiofrequency identification circuit to the slot antenna, thereby providing a radiofrequency tag in the multilayer package.
摘要（中）：
There is also provided a method for making a multilayer package comprising a radiofrequency tag, comprising the following steps:
- obtaining a multilayer package having at least one conductive layer, a slot antenna being formed in the at least one conductive layer of the multilayer package; and
- installing a radiofrequency identification circuit on the multilayer package, so as to link the radiofrequency identification circuit to the slot antenna, thereby providing a radiofrequency tag in the multilayer package.
提供了一种具有至少一个导电层，其包括的射频标签（20）的多层封装，射频标签包括射频识别电路（22）和一个缝隙天线（24A），所述射频识别电路被连接到缝隙天线 确实是在多层包装中的所述至少一个导电层形成。 从而提供了一种用于制造多层封装包括射频标签，其包括以下步骤的方法： - 获得具有至少一个导电层的多层封装，缝隙天线形成在所述多层集成电路封装中的所述至少一个导电层; 和 - 安装在所述多层封装的射频识别电路，以便将射频识别电路链接到缝隙天线，由此提供在多层封装中的射频标签。
IPC结构图谱:
| G | 物理 |
| --G06 | 计算；推算；计数 |
| ----G06K | 数据识别；数据表示；记录载体；记录载体的处理 |
| ------G06K19/00 | 连同机器一起使用的记录载体，并且至少其中一部分设计带有数字标记 |
| --------G06K19/06 | .按数字标记的种类区分的，例如，形状、性质、代码 |
| ----------G06K19/067 | ..带有导电标记、印刷电路或半导体电路元件的记录载体，例如，信用卡或识别卡 |
| ------------G06K19/07 | ...带有集成电路芯片 |
| --------------G06K19/077 | ....结构的细节，例如，在该载体中电路的装配 |