基本信息:
- 专利标题： NI BALL, NI CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM
- 申请号：EP14881484.1 申请日：2014-02-04
- 公开(公告)号：EP3103566B1 公开(公告)日：2018-11-14
- 发明人： KAWASAKI Hiroyoshi , AKAGAWA Takashi , KOIKEDA Yuichi , IKEDA Atsushi , SASAKI Masaru , ROPPONGI Takahiro , SOMA Daisuke , SATO Isamu
- 申请人： Senju Metal Industry Co., Ltd
- 申请人地址： 23 Senju-Hashido-cho Adachi-ku Tokyo 120-8555 JP
- 专利权人： Senju Metal Industry Co., Ltd
- 当前专利权人： Senju Metal Industry Co., Ltd
- 当前专利权人地址： 23 Senju-Hashido-cho Adachi-ku Tokyo 120-8555 JP
- 代理机构： D Young & Co LLP
- 国际公布： WO2015118613 20150813
- 主分类号： B22F1/00
- IPC分类号： B22F1/00 ; B22F1/02 ; B23K35/14 ; B23K35/22 ; B23K35/30 ; C22C19/03 ; C22F1/00 ; C22F1/10 ; C25D7/00 ; C22C1/04 ; B23K35/02 ; B23K35/26 ; B23K35/36 ; B23K35/362
摘要：
Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the solder ball 20. The 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20 and equal to or less than 90HV.
公开/授权文献:
IPC结构图谱:
| B | 作业；运输 |
| --B22 | 铸造；粉末冶金 |
| ----B22F | 金属粉末的加工；由金属粉末制造制品；金属粉末的制造 |
| ------B22F1/00 | 金属粉末的专门处理；如使之易于加工，改善其性质；金属粉末本身，如不同成分颗粒的混合物 |