基本信息:
- 专利标题： CIRCUIT SHEET ARRANGEMENT
- 申请号：EP14742317.2 申请日：2014-07-15
- 公开(公告)号：EP3022767B1 公开(公告)日：2018-11-21
- 发明人： STONE, Kate
- 申请人： Novalia Ltd
- 申请人地址： The Quorum Barnwell Road Cambridge CB5 8RE GB
- 专利权人： Novalia Ltd
- 当前专利权人： Novalia Ltd
- 当前专利权人地址： The Quorum Barnwell Road Cambridge CB5 8RE GB
- 代理机构： Piotrowicz, Pawel Jan Andrzej
- 优先权： GB201312607 20130715
- 国际公布： WO2015008059 20150122
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/538 ; H01L23/13 ; H05K1/02 ; H05K1/18
摘要：
An article comprises an electronic component, such as an integrated circuit or packaged integrated circuit, and a circuit sheet arrangement. The circuit sheet arrangement may comprise a flexible planar substrate and conductive tracks formed on a face of the substrate. The substrate is configured to have an aperture enclosed by surrounding portion of the substrate and to have at least two arms supporting respective conductive tracks which extend into the aperture from the surrounding portions. The electronic component is disposed over the aperture and is attached to conductive tracks on the arms, for example, using conductive glue or ink.
公开/授权文献:
- EP3022767A1 CIRCUIT SHEET ARRANGEMENT 公开/授权日：2016-05-25
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
| ------------H01L23/498 | ...引线位于绝缘衬底上的 |