基本信息:
- 专利标题： SEGMENTED FOCAL PLANE ARRAY ARCHITECTURE
- 专利标题（中）：具有分段焦平面阵列架构
- 申请号：EP13814375.5 申请日：2013-12-12
- 公开(公告)号：EP2932529A1 公开(公告)日：2015-10-21
- 发明人： SIMOLON, Brian , KURTH, Eric A. , NUSSMEIER, Mark , HÖGASTEN, Nicholas , HOELTER, Theodore R. , STRANDEMAR, Katrin , BOULANGER, Pierre , SHARP, Barbara
- 申请人： Flir Systems, Inc.
- 申请人地址： 27700 SW Parkway Avenue Wilsonville, OR 97070 US
- 专利权人： Flir Systems, Inc.
- 当前专利权人： Flir Systems, Inc.
- 当前专利权人地址： 27700 SW Parkway Avenue Wilsonville, OR 97070 US
- 代理机构： Kitzler, Michael
- 优先权： US201261737660P 20121214; US201261748018P 20121231
- 国际公布： WO2014093724 20140619
- 主分类号： H01L27/146
- IPC分类号： H01L27/146 ; G01J5/20
摘要：
Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.
公开/授权文献:
- EP2932529B1 SEGMENTED FOCAL PLANE ARRAY ARCHITECTURE 公开/授权日：2021-03-31
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L27/00 | 由在一个共用衬底内或其上形成的多个半导体或其他固态组件组成的器件 |
| --------H01L27/02 | .包括有专门适用于整流、振荡、放大或切换的半导体组件并且至少有一个电位跃变势垒或者表面势垒的；包括至少有一个跃变势垒或者表面势垒的无源集成电路单元的 |
| ----------H01L27/144 | ..由辐射控制的器件 |
| ------------H01L27/146 | ...图像结构 |