基本信息:
- 专利标题： SACRIFICIAL COVER LAYERS FOR LASER DRILLING SUBSTRATES AND METHODS THEREOF
- 专利标题（中）：OPFERDECKSCHICHTENFÜRLASERBOHRSUBSTRATE IN ENTSPRECHENDE VERFAHREN
- 申请号：EP13811681.9 申请日：2013-11-27
- 公开(公告)号：EP2925482A1 公开(公告)日：2015-10-07
- 发明人： SHOREY, Aric, Bruce , PIECH, Garrett, Andrew , LI, Xinghua , THOMAS, John, Christopher , KEECH, John, Tyler , DOMEY, Jeffrey, John , SHUSTACK, Paul, John
- 申请人： Corning Incorporated , Shorey, Aric Bruce , Piech, Garrett Andrew , Li, Xinghua , Thomas, John Christopher , Keech, John Tyler , Domey, Jeffrey J. , Shustack, Paul, John
- 申请人地址： 1 Riverfront Plaza Corning, New York 14831 US
- 专利权人： Corning Incorporated,Shorey, Aric Bruce,Piech, Garrett Andrew,Li, Xinghua,Thomas, John Christopher,Keech, John Tyler,Domey, Jeffrey J.,Shustack, Paul, John
- 当前专利权人： Corning Incorporated,Shorey, Aric Bruce,Piech, Garrett Andrew,Li, Xinghua,Thomas, John Christopher,Keech, John Tyler,Domey, Jeffrey J.,Shustack, Paul, John
- 当前专利权人地址： 1 Riverfront Plaza Corning, New York 14831 US
- 代理机构： Greene, Simon Kenneth
- 优先权： US201261730994P 20121129; US201361815864P 20130425; US201361817444P 20130430
- 国际公布： WO2014085660 20140605
- 主分类号： B23K26/18
- IPC分类号： B23K26/18 ; B23K26/38
摘要：
A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
摘要（中）：
一种用于通过钻孔在基板中形成多个精密孔的方法，包括将牺牲覆盖层固定到基板的表面，将激光束相对于基板定位在预定位置，并且对应于 多个精密孔，通过在预定位置重复地激励激光束在牺牲覆盖层中形成通孔，并将激光束脉冲到形成在牺牲覆盖层中的通孔中。 一种具有精密孔的工件，其具有形成有精密孔的基板，其中，各精密孔的纵轴在基板的厚度方向上延伸，牺牲覆盖层可拆卸地固定到基板的表面， 牺牲覆盖层减少精密孔的不规则性。
IPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K26/00 | 用激光束加工，例如焊接，切割，打孔 |
| --------B23K26/18 | .在被加工材料上采用吸收层，例如为作标记或起保护作用 |