发明公开
EP2893783A1 METHOD AND STRUCTURE FOR FORMING CONTACT PADS ON A PRINTED CIRCUIT BOARD USING ZERO UNDER- CUT TECHNOLOGY
审中-公开
基本信息:
- 专利标题： METHOD AND STRUCTURE FOR FORMING CONTACT PADS ON A PRINTED CIRCUIT BOARD USING ZERO UNDER- CUT TECHNOLOGY
- 专利标题（中）：方法与结构接触表面上的电路板面平整使用零退刀技术
- 申请号：EP13834789.3 申请日：2013-08-09
- 公开(公告)号：EP2893783A1 公开(公告)日：2015-07-15
- 发明人： TURPUSEEMA, Dan , RUSSELL, James V
- 申请人： R&D Circuits Inc.
- 申请人地址： 3601 South Clinton Avenue South Plainfield, NJ 07080 US
- 专利权人： R&D Circuits Inc.
- 当前专利权人： R&D Circuits Inc.
- 当前专利权人地址： 3601 South Clinton Avenue South Plainfield, NJ 07080 US
- 代理机构： Games, Robert Harland
- 优先权： US201261743596P 20120907
- 国际公布： WO2014039072 20140313
- 主分类号： H05K3/06
- IPC分类号： H05K3/06 ; H05K1/02 ; H01L21/02
摘要：
A method and an apparatus for forming a contact pad on a printed circuit board over a filled plate via or blind in which an additional metallic or a non metallic coating is applied to a final surface finished plate which encapsulates the side walls of the wear resistant surface plate, and also covers the side walls of the metal layer plated onto the filled via and the wrap around plated metal which was plated in the via and onto the surface of the base metal to the extents of the pad geometry. This prevents subsequent undermining through the etching process and ensuring the integrity and reliability of the vias' electrical connection when an underlying base metal such as but not limited to copper and the surface plated metal are formed when plating metal in the via and consequently onto the surface.
摘要（中）：
一种用于经由或盲在其中附加金属或非金属涂层在填充板形成的接触焊盘上的印刷电路板的方法和装置应用于最终表面成品板封装了耐磨表面的侧壁 板等覆盖经由镀在填充在金属层和周围的金属镀涡卷其在所述通孔和在基体金属到垫的几何形状的盘区的表面镀覆的侧壁上。 这防止随后通过蚀刻工艺破坏和确保通孔电当一个基础基部金属连接的完整性和可靠性：例如但不限于铜和表面镀覆金属形成当通过并因此在表面上的镀敷金属 ，
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上，而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
| ----------H05K3/06 | ..用化学或电解方法将导电材料去除的，例如用光刻工艺 |