基本信息:
- 专利标题： HOUSING UNIT WITH HEAT SINK
- 专利标题（中）：带散热片外壳单元
- 申请号：EP13759948.6 申请日：2013-08-28
- 公开(公告)号：EP2891398A1 公开(公告)日：2015-07-08
- 发明人： WARREN, Gary , VAN ROON, Darren , STEANE, Steve , GRILLS, Reginald C.
- 申请人： FLEXTRONICS AP, LLC
- 申请人地址： 305 Interlocken Parkway Broomfield, CO 80021 US
- 专利权人： FLEXTRONICS AP, LLC
- 当前专利权人： FLEXTRONICS AP, LLC
- 当前专利权人地址： FLEXTRONICS AP, LLC
- 代理机构： Rupprecht, Kay
- 优先权： US201213601421 20120831
- 国际公布： WO2014036096 20140306
- 主分类号： H05K9/00
- IPC分类号： H05K9/00 ; H05K5/00 ; H05K7/20
摘要：
Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.
公开/授权文献:
- EP2891398B1 HOUSING UNIT WITH HEAT SINK 公开/授权日：2020-07-15
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K9/00 | 设备或元件对电场或磁场的屏蔽 |