![Electronic device and method for assembling the same](/ep/2018/06/27/EP2876983B1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: Electronic device and method for assembling the same
- 申请号:EP14194157.5 申请日:2014-11-20
- 公开(公告)号:EP2876983B1 公开(公告)日:2018-06-27
- 发明人: Lu, Xing-Xian , You, Pei-Ai , Liu, Gang , Zhang, Jin-Fa
- 申请人: Delta Electronics (Shanghai) Co., Ltd.
- 申请人地址: 1F&7F&8F, Building 1 No.1675 Huadong Road, Pudong 201209 Shanghai CN
- 专利权人: Delta Electronics (Shanghai) Co., Ltd.
- 当前专利权人: Delta Electronics (Shanghai) Co., Ltd.
- 当前专利权人地址: 1F&7F&8F, Building 1 No.1675 Huadong Road, Pudong 201209 Shanghai CN
- 代理机构: Nederlandsch Octrooibureau
- 优先权: CN201310612832 20131126
- 主分类号: H05K7/14
- IPC分类号: H05K7/14 ; H05K7/20 ; H05K5/00 ; B60L11/18 ; H05K3/32
摘要:
An electronic device includes a bottom case, an accommodation unit, an electromagnetic induction module, a heat-dissipating component, an elastic clip, a printed wiring board, and an electronic component. The accommodation unit is disposed on the bottom case. At least one portion of the electromagnetic induction module is disposed in the accommodation unit. The heat-dissipating component is disposed on the bottom case and is positioned separately from the accommodation unit. The elastic clip is partially mounted on the heat-dissipating component. The printed wiring board has a first surface and a second surface, and the first surface faces the accommodation unit. The electronic component includes a main body and pin feet. The pin feet are electrically connected to the printed wiring board, and the main body is clamped between the heat-dissipating component and the elastic clip.
公开/授权文献:
- EP2876983A3 Electronic device and method for assembling the same 公开/授权日:2015-08-05
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
--------H05K7/14 | .在外壳内或在框架上或在导轨上安装支承结构 |