基本信息:
- 专利标题： METHOD OF MAKING A SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT
- 申请号：EP13724714.4 申请日：2013-05-21
- 公开(公告)号：EP2852974B1 公开(公告)日：2018-08-01
- 发明人： MOHAMMED, Ilyas
- 申请人： Invensas Corporation
- 申请人地址： 3025 Orchard Parkway San Jose CA 95134 US
- 专利权人： Invensas Corporation
- 当前专利权人： Invensas Corporation
- 当前专利权人地址： 3025 Orchard Parkway San Jose CA 95134 US
- 代理机构： Hanna Moore + Curley
- 优先权： US201213477532 20120522
- 国际公布： WO2013177134 20131128
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L21/60 ; H01L21/48 ; H01L23/495 ; H01L25/10 ; H01L21/56
摘要：
A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are unconvered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.
公开/授权文献:
- EP2852974A1 SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT 公开/授权日：2015-04-01
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/065 | ...包含在H01L27/00组类型的器件 |