基本信息:
- 专利标题： Cavity package with pre-molded substrate
- 专利标题（中）：Hohlraumpaket mit vorgeformtem Substrat
- 申请号：EP14182490.4 申请日：2014-08-27
- 公开(公告)号：EP2843698A2 公开(公告)日：2015-03-04
- 发明人： Fan, Chun Ho
- 申请人： Ubotic Company Limited
- 申请人地址： Rm 18, 15/F, International Trade Centre 11-19 Sha Tsui Road Tsuen Wan, Hong Kong CN
- 专利权人： Ubotic Company Limited
- 当前专利权人： Ubotic Company Limited
- 当前专利权人地址： Rm 18, 15/F, International Trade Centre 11-19 Sha Tsui Road Tsuen Wan, Hong Kong CN
- 代理机构： ABG Patentes, S.L.
- 优先权： US201361870352P 20130827
- 主分类号： H01L23/047
- IPC分类号： H01L23/047 ; H01L23/10
摘要：
A cavity package is set forth along with a method of manufacturing thereof. The method comprises applying a selective plating resist to a metallic substrate in a pattern to expose portions for a ring, tie bars, die attach pad and input/output wire bonding pads; elective depositing of metal plating using the selective plating resist; removing the selective metal plating resist; applying a selective etching resist to the substrate; selectively etching portions of the substrate not covered by the selective etching resist; stripping away the selective etching resist; pre-molding a leadframe to the substrate so as to surround the die attach pad portion; etching the tie bars away from the bottom surface of the substrate; attaching a semiconductor device die to the die attach pad; wire bonding the semiconductor device to the input/output wire bonding pads; and attaching a cap to the ring portion of the substrate and the die attach pad to protect the wire bonded semiconductor device die and permit electrical grounding.
摘要（中）：
与其制造方法一起阐述了空腔包装。 该方法包括以图案向金属基底施加选择性电镀抗蚀剂，以露出用于环，连接条，管芯附着垫和输入/输出引线接合焊盘的部分; 使用选择性电镀抗蚀剂选择性沉积金属电镀; 去除选择性金属电镀抗蚀剂; 向所述基底施加选择性抗蚀剂; 选择性地蚀刻未被选择性蚀刻抗蚀剂覆盖的衬底的部分; 剥离选择性抗蚀剂; 将引线框预先模制到基板以围绕芯片附接焊盘部分; 将连接条蚀刻离开基板的底表面; 将半导体器件管芯附接到管芯附接焊盘; 将半导体器件引线接合到输入/输出引线接合焊盘; 并且将盖附接到基板的环部分和管芯附接垫以保护引线接合半导体器件管芯并允许电接地。
公开/授权文献:
- EP2843698A3 Cavity package with pre-molded substrate 公开/授权日：2015-04-01
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/04 | ..按外形区分的 |
| ------------H01L23/043 | ...中空容器，并有用于半导体本体的引线以及作为安装架的导电基座 |
| --------------H01L23/047 | ....其他引线平行于基座的 |