基本信息:
- 专利标题： STUB MINIMIZATION FOR MULTI-DIE WIREBOND ASSEMBLIES WITH PARALLEL WINDOWS
- 专利标题（中）：思维，尽量减少多芯片导线连接并行WINDOWS
- 申请号：EP12773463.0 申请日：2012-09-28
- 公开(公告)号：EP2764543A2 公开(公告)日：2014-08-13
- 发明人： CRISP, Richard, Dewitt , ZOHNI, Wael , HABA, Belgacem , LAMBRECHT, Frank
- 申请人： Invensas Corporation
- 申请人地址： 3025 Orchard Parkway San Jose, CA 95134 US
- 专利权人： Invensas Corporation
- 当前专利权人： Invensas Corporation
- 当前专利权人地址： 3025 Orchard Parkway San Jose, CA 95134 US
- 代理机构： Clark, Jane Anne
- 优先权： US201161542553P 20111003; US201113337565 20111227; US201113337575 20111227; US201213440515 20120405
- 国际公布： WO2013052372 20130411
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/49 ; H01L23/13 ; G11C5/04 ; G11C5/06 ; H01L23/31 ; H01L25/10 ; H01L25/00
摘要：
A microelectronic package 10 can include a substrate 20 having first and second surfaces 21, 22 and first and second apertures 26a, 26b extending therebetween, first and second microelectronic elements 30a, 30b each having a surface 31 facing the first surface, terminals 25a exposed at the second surface in a central region 23 thereof, and leads 40 electrically connected between contacts 35 exposed at the surface of each microelectronic element and the terminals. The apertures 26a, 26b can have first and second parallel axes 29a, 29b extending in directions of the lengths of the respective apertures. The central region 23 of the second surface 22 can be disposed between the first and second axes 29a, 29b. The terminals 25a can be configured to carry address information usable by circuitry within the microelectronic package 10 to determine an addressable memory location from among all the available addressable memory locations of a memory storage array of at least one of the microelectronic elements 30a, 30b.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/065 | ...包含在H01L27/00组类型的器件 |