基本信息:
- 专利标题： PACKAGING DRAM AND SOC IN AN IC PACKAGE
- 申请号：EP12753343.8 申请日：2012-08-22
- 公开(公告)号：EP2748850B1 公开(公告)日：2018-08-22
- 发明人： SUTARDJA, Sehat
- 申请人： Marvell World Trade Ltd.
- 申请人地址： L'Horizon Gunsite Road Brittons Hill St. Michael 14027 BB
- 专利权人： Marvell World Trade Ltd.
- 当前专利权人： MARVELL ASIA PTE, LTD., SG
- 当前专利权人地址： MARVELL ASIA PTE, LTD., SG
- 代理机构： Grünecker Patent- und Rechtsanwälte PartG mbB
- 优先权： US201161526586P 20110823; US201161548344P 20111018; US201213590949 20120821
- 国际公布： WO2013028745 20130228
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L25/10 ; H01L23/498 ; H01L23/13 ; H01L21/60 ; H01L25/065
摘要：
An integrated circuit package comprises a first memory die (458-1) having a first set of connections, a second memory die (458-2) arranged adjacent to the first memory die, the second memory die having a second set of connections, a first substrate (470) having a first opening (472-1) and a second opening (472-2), the first substrate having a third set of connections to connect (474-1) to the first set of connections of the first memory die via the first opening and a fourth set of connections to connect (474-2) to the second set of connections of the second memory die via the second opening, and a second substrate (456) having a first integrated circuit (454) disposed thereon. The first substrate is connected (460-2) to the second substrate with the first integrated circuit disposed between the first substrate and second substrate.
公开/授权文献:
- EP2748850A1 PACKAGING DRAM AND SOC IN AN IC PACKAGE 公开/授权日：2014-07-02
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/18 | .包含在H01L27/00至H01L51/00各组中两个或多个同一大组的不同小组内的类型的器件 |