基本信息:
- 专利标题： Light emitting device package
- 申请号：EP13168598.4 申请日：2013-05-21
- 公开(公告)号：EP2682987B1 公开(公告)日：2018-04-04
- 发明人： Cho, Hyun Seok
- 申请人： LG Innotek Co., Ltd.
- 申请人地址： 98, Huam-ro, Jung-gu Seoul, 04637 KR
- 专利权人： LG Innotek Co., Ltd.
- 当前专利权人： SUZHOU LEKIN SEMICONDUCTOR CO. LTD., TAICANG, CN
- 当前专利权人地址： SUZHOU LEKIN SEMICONDUCTOR CO. LTD., TAICANG, CN
- 代理机构： Cabinet Plasseraud
- 优先权： KR20120073696 20120706
- 主分类号： H01L25/075
- IPC分类号： H01L25/075 ; H01L33/62 ; H01L23/544 ; H01L33/60 ; H01L23/00
摘要：
Disclosed is a light emitting device package including a reflective substrate including a chip mounting region, a circuit substrate disposed on the reflective substrate, the circuit substrate including an inside edge defining the chip mounting region and at least one aligning hole disposed at a position spaced from the inside edge, and at least one light emitting diode chip disposed in the chip mounting region, the at least one light emitting diode chip being connected to the circuit substrate through a wire.
公开/授权文献:
- EP2682987A3 Light emitting device package 公开/授权日：2015-11-18
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
| --------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件，例如整流二极管的组装件 |
| ----------H01L25/04 | ..不具有单独容器的器件 |
| ------------H01L25/075 | ...包含在H01L33/00组类型的器件 |