发明公开
EP2650905A3 Methods and devices for fabricating and assembling printable semiconductor elements
有权
基本信息:
- 专利标题： Methods and devices for fabricating and assembling printable semiconductor elements
- 专利标题（中）：的方法和设备用于制造和装配可印刷的半导体元件
- 申请号：EP13003426.7 申请日：2005-06-02
- 公开(公告)号：EP2650905A3 公开(公告)日：2014-10-01
- 发明人： Nuzzo, Ralph G. , Rogers, John, A. , Menard, Etienne , Lee, Keon Jae , Khang, Dahl-Young , Sun, Yugang , Meitl, Matthew , Zhu, Zhengtao
- 申请人： The Board of Trustees of the University of Illinois
- 申请人地址： 352 Henry Administration Building 506 South Wright Street Urbana, IL 61801 US
- 专利权人： The Board of Trustees of the University of Illinois
- 当前专利权人： The Board of Trustees of the University of Illinois
- 当前专利权人地址： 352 Henry Administration Building 506 South Wright Street Urbana, IL 61801 US
- 代理机构： Zeuner Summerer Stütz
- 优先权： US577077P 20040604; US601061P 20040811; US650305P 20050204; US663391P 20050318; US677617P 20050504
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/326 ; H01L21/4763 ; H01L23/48 ; H01L27/01 ; H01L29/06 ; H01L29/08 ; H01L21/02
摘要：
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料 |
| --------------H01L21/30 | ....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的 |