基本信息:
- 专利标题： METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- 专利标题（中）：制造印刷电路板的方法
- 申请号：EP11854490.7 申请日：2011-12-23
- 公开(公告)号：EP2647267B1 公开(公告)日：2018-03-07
- 发明人： MAENG, Il Sang
- 申请人： LG Innotek Co., Ltd.
- 申请人地址： 98, Huam-ro, Jung-gu Seoul, 04637 KR
- 专利权人： LG Innotek Co., Ltd.
- 当前专利权人： LG Innotek Co., Ltd.
- 当前专利权人地址： 98, Huam-ro, Jung-gu Seoul, 04637 KR
- 代理机构： Novagraaf Technologies
- 优先权： KR20100136072 20101227
- 国际公布： WO2012091373 20120705
- 主分类号： H05K3/18
- IPC分类号： H05K3/18 ; H05K3/06
摘要：
The embodiment relates to a printed circuit board. The printed circuit board includes an insulating substrate having a plurality of circuit pattern grooves, a conductive absorption layer including conductive particles absorbed into inner walls of the circuit pattern grooves and circuit patterns formed on the conductive absorption layer such that the circuit pattern grooves are filled with the circuit patterns. Since the electroplating process is selectively performed with respect to inner portions of the pattern grooves by using the conductive absorption layer as a seed layer, the plating layer is not formed on the insulating layer except for the pattern grooves, so that the etching process for the electroplating layer is not necessary and the patterns are stably formed.
公开/授权文献:
- EP2647267A2 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 公开/授权日：2013-10-09
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上，而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
| ----------H05K3/18 | ..应用沉淀技术涂加导电材料的 |