发明公开
EP2571213A1 DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE
审中-公开
![DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE](/ep/2013/03/20/EP2571213A1/abs.jpg.150x150.jpg)
基本信息:
- 专利标题: DIFFERENTIAL SIGNAL TRANSMISSION LINE, IC PACKAGE, AND METHOD FOR TESTING SAID DIFFERENTIAL SIGNAL TRANSMISSION LINE AND IC PACKAGE
- 专利标题(中):线差信号的用于测试线差分信号和IC封装的传输的传输,IC封装及方法
- 申请号:EP11780340.3 申请日:2011-04-13
- 公开(公告)号:EP2571213A1 公开(公告)日:2013-03-20
- 发明人: MASUDA, Kohei , SHIBATA, Osamu , SUENAGA, Hiroshi , SAITO, Yoshiyuki
- 申请人: Panasonic Corporation
- 申请人地址: 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 JP
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 JP
- 代理机构: Eisenführ, Speiser & Partner
- 优先权: JP2010110220 20100512
- 国际公布: WO2011142079 20111117
- 主分类号: H04L25/02
- IPC分类号: H04L25/02 ; H01L23/50 ; H04B3/02
摘要:
An IC package (50) includes an integrated circuit (10) for transmitting and receiving a pair of differential signals composed of a signal having positive polarity and a signal having negative polarity, a first signal terminal (41a) for transmitting the signal having positive polarity, a second signal terminal (41b) for transmitting the signal having negative polarity, and a third terminal (43) arranged between the first signal terminal and the second signal terminal. The first and second terminals are electrically connected to the integrated circuit, and the third terminal (43) is not electrically connected to the integrated circuit.
摘要(中):
的IC封装(50)包括用于传送和接收一对信号组成的差分信号的具有正极性和信号具有负的极性,用于发射具有正极性的信号的第一信号端子(41A)的集成电路(10) ,用于发射具有极性负信号的第二信号端子(41B),并且所述第一信号端子和第二信号端子之间设置的第三端子(43)。 第一和第二端子电连接到所述集成电路,并且所述第三端子(43)不电连接到所述集成电路。