基本信息:
- 专利标题： METHOD FOR MANUFACTURING ALUMINUM FOIL
- 专利标题（中）：VERFAHREN ZUR HERSTELLUNG VON ALUMINIUMFOLIEN
- 申请号：EP10794101.5 申请日：2010-06-28
- 公开(公告)号：EP2450476A1 公开(公告)日：2012-05-09
- 发明人： OKAMOTO Atsushi , HOSHI Hiroyuki , ANDOU Setsuo
- 申请人： Hitachi Metals, Ltd.
- 申请人地址： 1-2-1, Shibaura Minato-ku Tokyo 105-8614 JP
- 专利权人： Hitachi Metals, Ltd.
- 当前专利权人： Hitachi Metals, Ltd.
- 当前专利权人地址： 1-2-1, Shibaura Minato-ku Tokyo 105-8614 JP
- 代理机构： Thun, Clemens
- 优先权： JP2009153923 20090629
- 国际公布： WO2011001932 20110106
- 主分类号： C25D1/04
- IPC分类号： C25D1/04 ; C22C21/00 ; C25D1/00 ; C25D3/66 ; H01G9/016 ; H01M4/66
摘要：
An obj ect of the present invention is to provide a method for producing a high-ductility, high-purity aluminum foil at a high film formation rate by electrolysis using a plating solution having a low chlorine concentration. A method for producing an aluminum foil of the present invention as a means for achieving the object is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution at least containing (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by a general formula: R 1 R 2 R 3 R 4 N·X (wherein R 1 to R 4 independently represent an alkyl group and X represents a counteranion for the quaternary ammonium cation), and then the film is removed from the substrate.
摘要（中）：
本发明的目的是提供一种通过使用具有低氯浓度的电镀液进行电解而以高成膜速度生产高延展性高纯度铝箔的方法。 本发明的铝箔的制造方法作为实现目的的方法，其特征在于，通过使用至少含有（1）二烷基砜的电镀液进行电解而在基板的表面上形成铝膜， 2）卤化铝，和（3）至少一种选自卤化铵，伯胺的卤化氢盐，仲胺的卤化氢盐，卤化氢盐， 叔胺和由以下通式表示的季铵盐：R 1 R 2 R 3 R 4 N·X（其中R 1至R 4独立地表示烷基且X表示季铵阳离子的抗衡阴离子）， 然后将膜从基材上除去。
公开/授权文献:
- EP2450476B1 METHOD FOR MANUFACTURING ALUMINUM FOIL 公开/授权日：2022-10-12
IPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D1/00 | 电铸 |
| --------C25D1/04 | .丝；带；箔 |