发明公开
EP2377633A4 SILVER MICROPARTICLE POWDER, METHOD FOR PRODUCING SAID POWDER, SILVER PASTE USING SAID POWDER, AND METHOD FOR USING SAID PASTE
有权
基本信息:
- 专利标题： SILVER MICROPARTICLE POWDER, METHOD FOR PRODUCING SAID POWDER, SILVER PASTE USING SAID POWDER, AND METHOD FOR USING SAID PASTE
- 专利标题（中）：银微粒粉末，工艺用于生产金粉，银粉膏粉及其使用方法膏体
- 申请号：EP09834511 申请日：2009-12-25
- 公开(公告)号：EP2377633A4 公开(公告)日：2014-03-26
- 发明人： KANEDA SHUJI , MOTOMURA KIMIKAZU , KARIYASU TATSUYA , HISAEDA YUTAKA , IHA KOSUKE
- 申请人： DOWA ELECTRONICS MATERIALS CO
- 专利权人： DOWA ELECTRONICS MATERIALS CO
- 当前专利权人： DOWA ELECTRONICS MATERIALS CO
- 优先权： JP2008335188 2008-12-26; JP2009146921 2009-06-19; JP2009285691 2009-12-16
- 主分类号： B22F9/24
- IPC分类号： B22F9/24 ; B22F1/00 ; B22F1/02 ; B22F9/00 ; B82Y30/00 ; B82Y40/00 ; B82Y99/00 ; C09C1/62 ; C09C3/06 ; C09C3/08 ; C09D5/24 ; C09D17/00 ; C22C5/08 ; H01B1/22 ; H01B5/00 ; H01B13/00 ; H01M4/38
摘要：
A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (D TEM ) of 5 to 100 nm as measured using a transmission electron microscope.
IPC结构图谱:
| B | 作业；运输 |
| --B22 | 铸造；粉末冶金 |
| ----B22F | 金属粉末的加工；由金属粉末制造制品；金属粉末的制造 |
| ------B22F9/00 | 制造金属粉末或其悬浮物 |
| --------B22F9/02 | .用物理方法 |
| ----------B22F9/18 | ..利用金属化合物的还原 |
| ------------B22F9/24 | ...从液体金属化合物开始，如溶液 |