基本信息:
- 专利标题： WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- 申请号：EP09732413.1 申请日：2009-04-06
- 公开(公告)号：EP2274962B1 公开(公告)日：2018-07-11
- 发明人： PALM, Petteri , KUJALA, Arni
- 申请人： GE Embedded Electronics Oy
- 申请人地址： Kuortaneenkatu 2 00510 Helsinki FI
- 专利权人： GE Embedded Electronics Oy
- 当前专利权人： IMBERATEK, LLC (N.D.GES.D.STAATES DELAWARE), H, US
- 当前专利权人地址： IMBERATEK, LLC (N.D.GES.D.STAATES DELAWARE), H, US
- 代理机构： Seppo Laine Oy
- 优先权： FI20085332 20080418
- 国际公布： WO2009127780 20091022
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/00 ; H01L23/31 ; H01L25/00
摘要：
A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.
公开/授权文献:
- EP2274962A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 公开/授权日：2011-01-19
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/18 | .在结构上与非印制电元件相联接的印刷电路 |