发明公开
EP2174349A2 METAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
审中-公开
基本信息:
- 专利标题： METAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
- 专利标题（中）：基于金属KAPSELUNGSSUBSTRAT本应用于立体多层封装及其制造方法
- 申请号：EP07808277.3 申请日：2007-09-18
- 公开(公告)号：EP2174349A2 公开(公告)日：2010-04-14
- 发明人： KWON, Young-Se , KIM, Kyoung-Min , YU, Je-In
- 申请人： Wavenics, Inc. , Korea Advanced Institute of Science and Technology
- 申请人地址： Bandochedong 2305 KAIST 373-1 Guseong-dong Yuseong-gu Daejeon-city 305-338 KR
- 专利权人： Wavenics, Inc.,Korea Advanced Institute of Science and Technology
- 当前专利权人： Wavenics, Inc.,Korea Advanced Institute of Science and Technology
- 当前专利权人地址： Bandochedong 2305 KAIST 373-1 Guseong-dong Yuseong-gu Daejeon-city 305-338 KR
- 代理机构： Delorme, Nicolas
- 优先权： KR20070076676 20070731
- 国际公布： WO2009017271 20090205
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/58 ; H01L23/28
摘要：
A package substrate, a manufacturing method thereof, a base package module (200), and a multi-layered package module having package substrates (100a, 100b, 100c) laminated on upper and lower portions of a base package module (200) are provided. The base package module (200) includes a base metal substrate (40), a first metal oxide layer (44) that is formed on the base metal substrate to have a cavity (47) therein, a device (48) that is mounted in the cavity (47) on the base metal substrate (200) and insulated by the first metal oxide layer (44) formed on a sidewall in the cavity (47), and a conductor (50) that is connected to the device (48) and a wiring pad (61 ) formed on the first metal oxide layer (44) on the base metal substrate (200). The package substrate includes a wiring pad (61 ), a conductor line (50), a second metal oxide layer (18) having an opening (22) that exposes a device (48), and a via (20) that is connected to the wiring pad (61 ) through a connection pad (62) in the second metal oxide layer (18).
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |