发明公开
EP2149622A4 PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT
审中-公开
基本信息:
- 专利标题： PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT
- 专利标题（中）：用于电镀树脂体的预处理方法，用于镀制受限形状体和预处理剂的方法
- 申请号：EP08752904 申请日：2008-05-16
- 公开(公告)号：EP2149622A4 公开(公告)日：2010-07-28
- 发明人： NAGAO TOSHIMITSU , YOSHIKANE YUSUKE , YOSHIKAWA JUNJI , MORIMOTO TORU , MURATA TOSHIYA , SATOU KAZUYA
- 申请人： OKUNO CHEM IND CO
- 专利权人： OKUNO CHEM IND CO
- 当前专利权人： OKUNO CHEM IND CO
- 优先权： JP2007135200 2007-05-22
- 主分类号： C23C18/24
- IPC分类号： C23C18/24 ; C23C18/16 ; C23C18/20 ; C23C18/22 ; C23C18/28 ; C23C18/30 ; C25D5/56
摘要：
The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.