基本信息:
- 专利标题： Cooling system for electronic equipment
- 专利标题（中）：冷却系统用于电子设备
- 申请号：EP09001786.4 申请日：2009-02-09
- 公开(公告)号：EP2091314A2 公开(公告)日：2009-08-19
- 发明人： Kashirajima , Yasuhiro , Kikuchi, Hiroshige , Sugiura, Takumi , Watanabe, Koji , Nakashima, Kenichi
- 申请人： Hitachi Plant Technologies, Ltd.
- 申请人地址： 5-2 Higashi-Ikeburo 4-chome Toshima-ku Tokyo JP
- 专利权人： Hitachi Plant Technologies, Ltd.
- 当前专利权人： Hitachi Plant Technologies, Ltd.
- 当前专利权人地址： 5-2 Higashi-Ikeburo 4-chome Toshima-ku Tokyo JP
- 代理机构： Hering, Hartmut
- 优先权： JP2008032096 20080213
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F25B23/00
摘要：
An electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost. Server rooms (14A, 14B) in which a plurality of servers (28) are placed, an evaporator (34) which is provided close to each of the servers (28), and cools exhaust air from the server (28) by vaporizing a refrigerant with heat generating from the server (28), a cooling tower (38) which is provided at a place higher than the evaporator (34), cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line (40) in which the refrigerant naturally circulates between the evaporator (34) and the cooling tower (38).
公开/授权文献:
- EP2091314B1 Cooling system for electronic equipment 公开/授权日：2016-04-20
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
| --------H05K7/20 | .便于冷却、通风或加热的改进 |