基本信息:
- 专利标题： ELECTROCHEMICAL CO-DEPOSITION OF SOL-GEL FILMS
- 专利标题（中）：电化学共沉积溶胶 - 凝胶薄膜的
- 申请号：EP07827190.5 申请日：2007-10-07
- 公开(公告)号：EP2084311A2 公开(公告)日：2009-08-05
- 发明人： MANDLER, Daniel , AVNIR, David , SHACHAM, Ronen
- 申请人： Yissum Research Development Company of the Hebrew University of Jerusalem
- 申请人地址： Edmond Safra Campus Hi Tech Park Givat Ram Jerusalem 91390 IL
- 专利权人： Yissum Research Development Company of the Hebrew University of Jerusalem
- 当前专利权人： Yissum Research Development Company of the Hebrew University of Jerusalem
- 当前专利权人地址： Edmond Safra Campus Hi Tech Park Givat Ram Jerusalem 91390 IL
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： US847378P 20060927
- 国际公布： WO2008038293 20080403
- 主分类号： C25D9/04
- IPC分类号： C25D9/04 ; C25D9/06
摘要：
The invention provides a new method for the electrochemical co-deposition of sol-gel and one or more additives selected amongst a great variety of agents such as monomers, oligomers, polymers, metals and others. The method affords continuous films of high stability and precision.
IPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D9/00 | 非金属电镀层 |
| --------C25D9/04 | .无机材料的 |