基本信息:
- 专利标题： FIXED JIG, CHIP PICKUP METHOD AND CHIP PICKUP APPARATUS
- 专利标题（中）：盛宴EINSPANNUNGSVORRICHTUNG，CHIP摄像处理芯片拾取装置
- 申请号：EP07829746.2 申请日：2007-10-12
- 公开(公告)号：EP2080220A1 公开(公告)日：2009-07-22
- 发明人： WATANABE, Kenichi , SEGAWA, Takeshi , FUJIMOTO, Hironobu
- 申请人： Lintec Corporation
- 申请人地址： 23-23, Honcho Itabashi-ku Tokyo 173-0001 JP
- 专利权人： Lintec Corporation
- 当前专利权人： Lintec Corporation
- 当前专利权人地址： 23-23, Honcho Itabashi-ku Tokyo 173-0001 JP
- 代理机构： Gardiner, Stephen Robin
- 优先权： JP2006283984 20061018
- 国际公布： WO2008047732 20080424
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H01L21/301 ; H01L21/52 ; H01L21/67
摘要：
[PROBLEMS] To provide a fixed jig which can unmovably suck a chip group produced by segmenting a semiconductor wafer, and can suck one chip by stripping the chip selectively and surely from the chip group. [MEANS FOR SOLVING PROBLEMS] A fixed jig (3) is composed of a jig base (30) and an adhesion layer (31). A recess (2) is provided on one side of the jig base (30). The recess (2) is sectioned into small chambers (15) by a partition (12) of the substantially same height as that of a sidewall (35). The sidewall (35) is provided to cover the recess (2), and the adhesion layer (31) is provided on the upper edge of the partition (12). A through hole (17) communicating with the outside is formed in each small chamber (15).