发明公开
EP2076922A1 SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC INSULATING FILM AND MANUFACTURING METHOD OF THE SAME
有权
基本信息:
- 专利标题： SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC INSULATING FILM AND MANUFACTURING METHOD OF THE SAME
- 专利标题（中）：与生产低介质隔离和方法的薄膜半导体元件
- 申请号：EP08765221.0 申请日：2008-05-30
- 公开(公告)号：EP2076922A1 公开(公告)日：2009-07-08
- 发明人： MIZUSAWA, Aido , OKADA, Osamu , WAKABAYASHI, Takeshi , MIHARA, Ichiro
- 申请人： Casio Computer Co., Ltd.
- 申请人地址： 6-2, Hon-machi 1-chome Shibuya-ku Tokyo 151-8543 JP
- 专利权人： Casio Computer Co., Ltd.
- 当前专利权人： Casio Computer Co., Ltd.
- 当前专利权人地址： 6-2, Hon-machi 1-chome Shibuya-ku Tokyo 151-8543 JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： JP2007244977 20070921; JP2008047090 20080228
- 国际公布： WO2009037902 20090326
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/485 ; H01L23/525
摘要：
A semiconductor device includes a semiconductor substrate (1) on which a structure portion (3) is provided except a peripheral portion thereof, and has a laminated structure including low dielectric films (4) and wiring lines (5), the low dielectric films having a relative dielectric constant of 3.0 or lower and a glass transition temperature of 400°C or higher. An insulating film (9) is formed on the structure portion (3). A connection pad portion is arranged on the insulating film (9) and connected to an uppermost wiring line (5) of the laminated structure portion (3). A bump electrode (13) is provided on the connection pad portion. A sealing film (14) made of an organic resin is provided on a part of the insulating film (9) which surrounds the bump electrode (13). Side surfaces of the laminated structure portion (3) are covered with the insulating film (9) and/or the sealing film (14).
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/31 | ..按配置特点进行区分的 |