基本信息:
- 专利标题： Mounting structure
- 专利标题（中）：Montagestruktur
- 申请号：EP08161081.8 申请日：2002-11-12
- 公开(公告)号：EP1986244A3 公开(公告)日：2010-02-17
- 发明人： Shigaki, Masafumi , Nakazawa, Isao , Yamanaka, Kazunori
- 申请人： Fujitsu Limited
- 申请人地址： 1-1, Kamikodanaka 4-chome Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： 1-1, Kamikodanaka 4-chome Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 代理机构： Stebbing, Timothy Charles
- 主分类号： H01L39/04
- IPC分类号： H01L39/04 ; H05K1/02 ; H01L23/40 ; H01L23/66
摘要：
A mounting structure for mounting a superconducting circuit board (74) in a metal case (71). The mounting structure comprises an electrically conductive sheet (73) having thermal conductivity and exhibiting restorability wherein said sheet (73) is laid on the bottom of a box-shaped metal case (71), a superconducting circuit board (74) is placed on the sheet (73), and said superconducting circuit board (74) and sheet (73) are fastened together and attached to the metal case (71) by two or more screws (75a-75e). Holes are provided at positions in the sheet where the screws pass through to achieve a sheet-less state, and the package and sheet (73) are fastened together by the screws (75a-75e). The sheet (73) is mounted on the case (71) while the sheet (73) is pressed by a pressing force of 10 N/cm 2 or greater.
公开/授权文献:
- EP1986244B1 Mounting structure 公开/授权日：2017-01-11