基本信息:
- 专利标题： Electronic component embedded board and its manufacturing method
- 专利标题（中）：嵌入式组件及其制备方法局
- 申请号：EP06019174.9 申请日：2006-09-13
- 公开(公告)号：EP1763295A3 公开(公告)日：2008-04-30
- 发明人： Sunohara, Masahiro
- 申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 申请人地址： 80 Oshimada-machi Nagano-shi, Nagano 381-2287 JP
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址： 80 Oshimada-machi Nagano-shi, Nagano 381-2287 JP
- 代理机构： Zimmermann, Gerd Heinrich
- 优先权： JP2005264746 20050913
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/46
摘要：
A second substrate (12) is provided above a first substrate (11), and an electronic component (13) is arranged between the first substrate (11) and the second substrate (12) so that between the first substrate (11) and the second substrate (12), the electronic component (13) is sealed and a photosensitive resin (14) having adhesion is provided to bond the first substrate (11) and the second substrate (12) to each other.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/18 | .在结构上与非印制电元件相联接的印刷电路 |